Technical Capabilities

Serial Technical Parameters Technical capabilities
1 Max Layer count 1-28
2 Max board size 450x1800mm (18"x71")
3 Min Board Thickness 4 layers 0.38mm 15mil
6layers 0.55mm 22mil
8layers0.80mm 32mil
10layers1.00mm 40mil
4 Copper Clad(Max.) 6 oz(outer)/4 oz(inner)
5 Min line Width/space 0.075mm         3mil
6 Min hole size 0.15mm          6mil
7 PTH wall thickness 0.025mm         1mil
8 PTH hole dia. tolerance ±0.075mm       3mil
9 Non PTH hole dia. tolerance ±0.05mm        2mil
10 Hole position deviation ±0.05mm        2mil
11 Outline tolerance ±0.10mm        4mil
12 Min S/M Pitch 0.075mm         3mil
13 Twist and Bow ≤1.0%
14 Insulation Resistance >1012Ω
15 Test Voltage 50~300v
16 Electric strength >1.3KV/mm
17 Current breakdown 10A
18 Peel strength 1.4N/mm
19 Soldermask abrasion >6H
20 Thermal stress 288℃  20Sec
21 Flammability 94V-0
22 Impedance Control +/-5%(Differential)
23 Blind/Buried via  √
24 Surface Finished  ENIG,ImAg,ImSn,OSP,Leaded HAL,      Lead free HAL(SN100C), Flash Gold,Hard Gold
25 Materials Getek ,Rogers ,Aluminum/Coper Based FR-4, High Tg FR-4,Teflon